Spot plating is plated with technology only where necessary.
Can significantly reduce the amount of use Au.
Material: Cu alloy
Material Thicness: 0.08mm～
Material width: ～20mm
Plathing thicness: Ni 1μm～ Au0.1～0.5μm
Solder Barrier area: 0.3mm～
Method of forming a Solder Barrier : Lazer or special masking
Example of Spot Plating
Visual Inspection System by in-house production
Tin plating is used as an alternative to leadcontaining solder plating. It is necessary to take a measure for whisker. Internal stress of crystal particles which causes whiker can be eased by reflowing process. We produce reflow tin plating for connector in volume.
|After plating||PCT: 5hrs||PCT: 16hrs|
|Before reflow||After reflow||Before reflow||After reflow||Before reflow||After reflow|
Measurement: SWET-2000 / Sn-3Ag-0.5Cu Solder / Rosin flux PCT: 121℃-100℃RH
||A||Chip resistor, Chip capacitor, Chip inductor, Chip filter, SMD products by chip type|
||Small stamping parts|
||A||min 1.0mm × 0.5mm ~|
||Pin: min ø0.5mm × 2mm ~
Plate: min 2.0mm × 1.5mm ~
||Electrolytic Ni, Sn or Au|
||Electroless Ni, Electro Ni / Electro Au, Electro Ni / Electro Sn, Electro Ni / Electro Ag, Electro Cu|
A) Possible to plate various chip size devices with flexible treatment.
B) Possible to plating small parts with various kind of plating.
Traditionally, when film formation to maintain smooth as glass and plastic, been using dry process is expensive.
Maintaining surface smoothness of the material, can form a solid film by this new plating process.
Maintain the smoothness of nanoscale.
Without using a dry process, polyimide,glass,PET, PEN ,PPA, LCP, Polycarbonate plating can be formed into high performance and lowcost.
Can also ITO electrode plating thicktype electroless Au.
Can form the plating material is used in brazing electronic packaging devices.
80Au/20Sn alloys by plating forming.
|Base material selection||○||△|
ITO: Before etching
Ra: 0.65nm Rz: 3.62nm
ITO: After etching
Ra: 2.78nm Rz: 14.37nm
Glass: Before etching
Ra: 0.35nm Rz: 1.84nm
Glass: After etching
Ra: 0.42nm Rz: 2.25nm
By etching ITO selectively, the surface of glass has not changed while the ITO surface gets four times rough.
Direct Ink-based Process is simple and easy way to non-resist electrode patterning by plating based on water-soluble polymer ink.
1. UV type
2. Inkjet type
Controling nanocrystal structure with Fe 36 ~ 42% Ni alloy plating film as invar alloy reduces the stress of film and it enables plating without warp more than 100μm. After heating the invar alloy plating film at 400 to 600°C, its low linear expansion coefficient is equivalent to melting invar alloy's.