Plating of electronic substrate and devices for microelectronics

Electroless Au plating for fineline circuit on PC board

(L/S=30/30µm)

Electroless Ni/Pd/Au
plating for micro-circuit

Excellent soldering, wirebondability. 3layers plating:Ni/Pd/Au is improved surface mounting reliability.

Au Wire pull test

Ball share test

Au Plating for LTCC substrate

Electroless plating process for LTCC substrate silver electrode

Wire pull strength on thicktype electroless Au plating film

Electrode: Electroless plating on Ag/Pt
Plating thickness: Ni3μm Au0.4μm N=50
Au wire: 30μmφ Bonder: Kaijo118CH (Full auto type)

Micro spot plating for micro connector

Spot plating is plated with technology only where necessary.
Can significantly reduce the amount of use Au.

Material: Cu alloy
Material Thicness: 0.08mm~
Material width: ~20mm
Plathing thicness: Ni 1μm~ Au0.1~0.5μm
Solder Barrier area: 0.3mm~
Method of forming a Solder Barrier : Lazer or special masking

Example of Spot Plating

Visual Inspection System by in-house production

↑ Back to pagetop

New technology of plating for microelectronics

Pb free plating

Reflow tin plating

Tin plating is used as an alternative to leadcontaining solder plating. It is necessary to take a measure for whisker. Internal stress of crystal particles which causes whiker can be eased by reflowing process. We produce reflow tin plating for connector in volume.

Before reflow

After reflow

Surface of reflow tin

Before reflow

After reflow

Before reflow

After reflow

Zero-cross time (second)
  After plating PCT: 5hrs PCT: 16hrs
  Before reflow After reflow Before reflow After reflow Before reflow After reflow
1 0.33 0.80 0.47 0.70 0.58 1.08
2 0.43 0.70 0.42 0.80 0.51 1.36
3 0.32 0.69 0.40 0.93 0.48 1.50
4 0.32 0.71 0.50 0.95 0.30 1.04
5 0.35 0.44 0.63 1.16 0.43 1.48
AVE. 0.35 0.67 0.48 0.91 0.46 1.29
MAX. 0.43 1.80 0.63 1.16 0.58 1.50
Min. 0.32 0.44 0.40 0.70 0.30 1.04
STD. 0.05 0.13 0.09 0.17 0.10 0.22

Measurement: SWET-2000 / Sn-3Ag-0.5Cu Solder / Rosin flux    PCT: 121℃-100℃RH

Reflow tin whiskers

Cu/Sn 1μm

46 days later

Non-reflow

After reflow

4 months later

Non-reflow

After reflow

Barrel Plating

Products
A Chip resistor, Chip capacitor, Chip inductor, Chip filter, SMD products by chip type
B
Small stamping parts
Size
A min 1.0mm × 0.5mm ~
B
Pin: min ø0.5mm × 2mm ~
Plate: min 2.0mm × 1.5mm ~
Plating Thickness
A
Electrolytic Ni, Sn or Au
B
Electroless Ni, Electro Ni / Electro Au, Electro Ni / Electro Sn, Electro Ni / Electro Ag, Electro Cu

A) Possible to plate various chip size devices with flexible treatment.
B) Possible to plating small parts with various kind of plating.

Gold plating for small connector parts

Tin plating to chip device

↑ Back to pagetop

New technology of plating for microelectronics

Etching free plating without
using roughned process

Direct plating of
organic film material

Traditionally, when film formation to maintain smooth as glass and plastic, been using dry process is expensive.
Maintaining surface smoothness of the material, can form a solid film by this new plating process.
Maintain the smoothness of nanoscale.

Feature

Without using a dry process, polyimide,glass,PET, PEN ,PPA, LCP, Polycarbonate plating can be formed into high performance and lowcost.
Can also ITO electrode plating thicktype electroless Au.

Gold Tin Alloys by plating forming for Brazing assembly

Can form the plating material is used in brazing electronic packaging devices.
80Au/20Sn alloys by plating forming.

Comparison: plating VS rollong foil
  plating traditinal
Oxdation
Base material selection
Out gas
wettability
Thicness control
cost
Ratio control

Molten state of
plating Au80/Sn20

Molten state of
Traditional brazing

New development plating

Electroless plating on ITO electrade

Roughness if surface on ITO and glass substrate after etching

ITO: Before etching
Ra: 0.65nm Rz: 3.62nm

ITO: After etching
Ra: 2.78nm Rz: 14.37nm

Glass: Before etching
Ra: 0.35nm Rz: 1.84nm

Glass: After etching
Ra: 0.42nm Rz: 2.25nm

By etching ITO selectively, the surface of glass has not changed while the ITO surface gets four times rough.

Direct Plating Process with Polymer Ink

Direct Ink-based Process is simple and easy way to non-resist electrode patterning by plating based on water-soluble polymer ink.

1. UV type

2. Inkjet type

Low Explansion Invar Alloy Plating

Controling nanocrystal structure with Fe 36 ~ 42% Ni alloy plating film as invar alloy reduces the stress of film and it enables plating without warp more than 100μm. After heating the invar alloy plating film at 400 to 600°C, its low linear expansion coefficient is equivalent to melting invar alloy's.

Electrocasting metal mask by invar alloy palting

 

↑ Back to pagetop