Plating of electronics substrate and devices for microelectronics

Electroless Au plating for fineline circuit on PC board

(L/S = 30/30µm)

Electroless Ni/Pd/Au plating for micro-circuit

Excellent soldering, wirebondability. 3layers plating:Ni/Pd/Au is improved surface mounting reliability.

Au Wire pull test

Ball share test

Au Plating for LTCC substrate

Electroless plating process for LTCC substrate silver electrode

Wire pull strength on thicktype electroless Au plating film

Electrode: Electroless plating on Ag/Pt
Plating thickness: Ni3μm Au0.4μm N=50
Au wire: 30μmφ Bonder: Kaijo118CH (Full auto type)

Gold plating for electroless wire bonding for semiconductor wafers

In recent years, while UBM formation (Under Bump Metal) by electroless plating on semiconductor wafer mounting pad electrodes has attracted attention, we have cultivated for many years, utilizing the gold plating technology for printed circuit boards used in SMD, etc., it is possible to process electroless gold plating for stable wire bonding.
Even wafers with a mixture of SR and polyimides can be selectively bonded gold plating on the pad.

Plating ProcessPlating ThicknessWafer SizeWafer ThicknessPadPad Size
ENIG
(Eletroless Ni/F-Au)
Ni:0.5~10um
Pd:0.02~0.8um
Au:0.02~0.8um
Small pieces
~8inch
*10 inches can be prototyped
300um~2mm
※300um or less Wafer reinforced by tape as needed
Alφ10um~
Plating support possible
ENIGAG
(Electroless Ni/Thick-Au)
Al-Si
ENEPIG
(Electroless Ni/Pd/F-Au)
Al-Si-Cu
ENEPIGAG
(Electroless Ni/Pd/Thick Au)
Al-Cu
Cu

Micro spot plating for micro connector

Spot plating is plated with technology only where necessary.
Can significantly reduce the amount of use Au.

Material: Cu alloy
Material Thicness: 0.08mm~
Material width: ~20mm
Plathing thicness: Ni 1μm~ Au0.1~0.5μm
Solder Barrier area: 0.3mm~
Method of forming a Solder Barrier : Lazer or special masking

Reel to reel plating for presses devices for automotive applications

TransportBy vertical transport, both single-tie bar and center carrier are possible.
Product shapeMaterials, primary pressed both possible
The material amplitudetandard Max100mmW *Consultation for more cases
Material thicknessStandard Max0.8mmt *Consultation for no more
OthersConsultation on mixed specifications of stripe and spot plating, stripe plating (±0.1 mm), etc.

Four color plating

Reflow tin plating with each different thickness

Spot plating

Sn reflow plating for automotive terminals

The temperature profile of the reflow is checked by the initial condition setting, and the pure tin thickness and the diffusion layer thickness are controlled. If necessary, we perform cross-sectional observation by CP and IM to ensure the plating layer structure.

Pb free plating

Reflow tin plating

Tin plating is used as an alternative to leadcontaining solder plating. It is necessary to take a measure for whisker. Internal stress of crystal particles which causes whiker can be eased by reflowing process. We produce reflow tin plating for connector in volume.

Surface of reflow tin

Zero-cross time (second)

 After platingPCT: 5hrsPCT: 16hrs
 Before reflowAfter reflowBefore reflowAfter reflowBefore reflowAfter reflow
10.330.800.470.700.581.08
20.430.700.420.800.511.36
30.320.690.400.930.481.50
40.320.710.500.950.301.04
50.350.440.631.160.431.48
AVE.0.350.670.480.910.461.29
MAX.0.431.800.631.160.581.50
Min.0.320.440.400.700.301.04
STD.0.050.130.090.170.100.22

Measurement: SWET-2000 / Sn-3Ag-0.5Cu Solder / Rosin flux
PCT: 121℃-100℃RH

Reflow tin whiskers

Cu/Sn 1μm

46 days later

4 months later

Barrel Plating

ProductsAChip resistor, Chip capacitor, Chip inductor, Chip filter, SMD products by chip type
BSmall stamping parts
SizeAmin 1.0mm × 0.5mm ~
BPin: min ø0.5mm × 2mm ~
Plate: min 2.0mm × 1.5mm ~
Plating ThicknessAElectrolytic Ni, Sn or Au
BElectroless Ni, Electro Ni / Electro Au, Electro Ni / Electro Sn, Electro Ni / Electro Ag, Electro Cu

A) Possible to plate various chip size devices with flexible treatment.
B) Possible to plating small parts with various kind of plating.

Plating on Metal foil

Continuous Ni and Au plating are possible for Cu, stainless steel foil material with the thinnest 10μm thick. (Maximum width 160mm)
It can be used as a reinforcing substrate for battery materials and flexible substrates.
It is possible to form wax materials with gold tin, silver tin, and silver copper by plating method to 30μm thick kovar material.
It is used as a sealing material such as ceramic packages.

 Material ThicknessPlatingPlating Thickness
Kovar10μmAu80/Sn204~20μm
Ag/Sn5~200μm
Ag/Cu4μm~
SUS・CuNi・Au1μm~
Film with Cu20μm~Ni/Au1μm/0.1μm~

Gold Tin Alloys by plating forming for Brazing assembly

Can form the plating material is used in brazing electronic packaging devices.
80Au/20Sn alloys by plating forming.

Comparison of plating with rolling foil

  plating traditinal
Oxdation
Base material selection
Out gas
wettability
Thicness control
cost
Ratio control

New technology of plating for microelectronics

Etching free plating without using roughned process

Direct plating of organic film material

Traditionally, when film formation to maintain smooth as glass and plastic, been using dry process is expensive.
Maintaining surface smoothness of the material, can form a solid film by this new plating process.
Maintain the smoothness of nanoscale.

Without using a dry process, polyimide,glass,PET, PEN ,PPA, LCP, Polycarbonate plating can be formed into high performance and lowcost.
Can also ITO electrode plating thicktype electroless Au.

Direct plating on glass

Usually, direct plating to glass strongly roughs the glass surface with hydrofluoric acid, etc., but in our development process, it is possible to form a plating film with mirror gloss by adopting a unique pretreatment that hardly devastates the material and a unique electroless plating with high uniformity.

Electroless Cu plating

Appearance surface roughness after plating
Our pretreatment, which hardly devastates the material, allows the surface roughness of the nano-order to form a high-adhesion plating film.

Zinc-free plating on aluminum

Usually, aluminum materials are highly solubility in acids and alkalis, and it is common to chemically perform zinc substitution (zinc treatment) and perform plating processing.
This technology is capable of plating directly into aluminum materials without zinc replacement treatment.
As a result, the process is shortened, and the partial plating method can be easily performed.

Process

Preprocessing

Material etching

Au Strike Plating

Bondable Au plating

Example of direct gold plating for aluminum lead frame

Material: A1020P.
Au plating thickness: 1μm (stripe plating)

Plating to non-woven fabric

It is a technology to uniformly coat various plating coatings to fibers such as non-woven fabric.

Roughed Ni plating

Nickel plating with an increased surface area by roughing the plating film can be produced for applications such as improving adhesion to resins. The entire surface is uneven and the Rz is over 2.0 μm.

FE-SEM secondary electron image (40° tilt)

Example of coarsened nickel plating
Material: Copper plate
Ni plating thickness: 5.0μm~

Unevenness measurement (laser microscope)

Roughness measurement results
Ra 0.31um
Rz 2.04um

Direct plating for titanium and SUS

Gold plating and nickel plating are possible directly on titanium, which is represented by difficult-to-plating materials. There is no defect between the material and the plating, and the adhesion is good. In addition, copper plating with good direct adhesion on SUS also possible.

FIB SIM image

Example of direct gold plating for titanium
Material: Titanium
  Au plating thickness: 0.2μm~

FIB SIM image

Example of direct copper plating of stainless steel
Material: SUS304
Cu plating thickness: 3.0μm~

Electroless plating on ITO electrade

Roughness if surface on ITO and glass substrate after etching

ITO: Before etching

Ra: 0.65nm Rz: 3.62nm

ITO: After etching

Ra: 2.78nm Rz: 14.37nm

Glass: Before etching

Ra: 0.35nm Rz: 1.84nm

Glass: After etching

Ra: 0.42nm Rz: 2.25nm

By etching ITO selectively, the surface of glass has not changed while the ITO surface gets four times rough.