Plating of electronics substrate and devices for microelectronics

Electroless Au plating for fineline circuit on PC board

(L/S = 30/30µm)

Electroless Ni/Pd/Au plating for micro-circuit

Excellent soldering, wirebondability. 3layers plating:Ni/Pd/Au is improved surface mounting reliability.

Au Wire pull test

Ball share test

Au Plating for LTCC substrate

Electroless plating process for LTCC substrate silver electrode

Wire pull strength on thicktype electroless Au plating film

Electrode: Electroless plating on Ag/Pt
Plating thickness: Ni3μm Au0.4μm N=50
Au wire: 30μmφ Bonder: Kaijo118CH (Full auto type)

Micro spot plating for micro connector

Spot plating is plated with technology only where necessary.
Can significantly reduce the amount of use Au.

Material: Cu alloyMaterial Thicness: 0.08mm~Material width: ~20mmPlathing thicness: Ni 1μm~ Au0.1~0.5μmSolder Barrier area: 0.3mm~Method of forming a Solder Barrier : Lazer or special masking

Pb free plating

Reflow tin plating

Tin plating is used as an alternative to leadcontaining solder plating. It is necessary to take a measure for whisker. Internal stress of crystal particles which causes whiker can be eased by reflowing process. We produce reflow tin plating for connector in volume.

Surface of reflow tin

Zero-cross time (second)

 After platingPCT: 5hrsPCT: 16hrs
 Before reflowAfter reflowBefore reflowAfter reflowBefore reflowAfter reflow

Measurement: SWET-2000 / Sn-3Ag-0.5Cu Solder / Rosin flux
PCT: 121℃-100℃RH

Reflow tin whiskers

Cu/Sn 1μm

46 days later

4 months later

Barrel Plating

ProductsAChip resistor, Chip capacitor, Chip inductor, Chip filter, SMD products by chip type
BSmall stamping parts
SizeAmin 1.0mm × 0.5mm ~
BPin: min ø0.5mm × 2mm ~
Plate: min 2.0mm × 1.5mm ~
Plating ThicknessAElectrolytic Ni, Sn or Au
BElectroless Ni, Electro Ni / Electro Au, Electro Ni / Electro Sn, Electro Ni / Electro Ag, Electro Cu

A) Possible to plate various chip size devices with flexible treatment.
B) Possible to plating small parts with various kind of plating.

New technology of plating for microelectronics

Etching free plating without using roughned process

Direct plating of organic film material

Traditionally, when film formation to maintain smooth as glass and plastic, been using dry process is expensive.
Maintaining surface smoothness of the material, can form a solid film by this new plating process.
Maintain the smoothness of nanoscale.

Without using a dry process, polyimide,glass,PET, PEN ,PPA, LCP, Polycarbonate plating can be formed into high performance and lowcost.
Can also ITO electrode plating thicktype electroless Au.

Gold Tin Alloys by plating forming for Brazing assembly

Can form the plating material is used in brazing electronic packaging devices.
80Au/20Sn alloys by plating forming.

Comparison of plating with rolling foil

  plating traditinal
Base material selection
Out gas
Thicness control
Ratio control

New Developing Plating

Electroless plating on ITO electrade

Roughness if surface on ITO and glass substrate after etching

ITO: Before etching

Ra: 0.65nm Rz: 3.62nm

ITO: After etching

Ra: 2.78nm Rz: 14.37nm

Glass: Before etching

Ra: 0.35nm Rz: 1.84nm

Glass: After etching

Ra: 0.42nm Rz: 2.25nm

By etching ITO selectively, the surface of glass has not changed while the ITO surface gets four times rough.

Direct Plating Process with Polymer Ink

Direct Ink-based Process is simple and easy way to non-resist electrode patterning by plating based on water-soluble polymer ink.

Low Explansion Invar Alloy Plating

Controling nanocrystal structure with Fe 36 ~ 42% Ni alloy plating film as invar alloy reduces the stress of film and it enables plating without warp more than 100μm. After heating the invar alloy plating film at 400 to 600°C, its low linear expansion coefficient is equivalent to melting invar alloy’s.

Electrocasting metal mask by invar alloy palting