CSR

Management Philosophy

"Giving shape to dreams"

We are committed to the challenge of Clean innovation
in response to our customers' needs.
We will shape dreams, surprises, excitement, and the future.
Everything is loved by the world as a partner

* What is "Clean Innovation"* Initiatives that our products, technologies, quality, and environment should always be "clean"

Sustainable Policy

1. Products

Together with our customers and partners, we will create technologies to solve social and environmental issues, enhance the value of people's lives around the world, and aim for the future of a sustainable earth and the development of society.

2. Cooperation with local communities and employees.

We provide all employees who share their management philosophy with opportunities for dialogue, a comfortable work environment, and a place for growth. In addition, we respect diverse cultures and values, take issues seriously, and contribute to the development of the local community.

3. Supply Chain

We will promote CSR procurement together with suppliers, taking into consideration the impact of our business activities on society and the environment.

4. Human Resource Development and Innovation

We foster an internal culture in which diverse people can maximize their abilities and expertise and make the most of each other' lives. We will also provide opportunities to develop human resources to challenge the transformation of innovative markets to solve global issues.

5. Environment

In order to achieve business development through the creation of environmental value with the aim of realizing a sustainable society, we will comply with the requirements applied through our business activities, improve environmental issues, and expand our environmental initiatives with sympathy from people in society.

Sustainability refers to the idea of making the world sustainable from three broad perspectives: environment, society, and economy.

Management, Quality and Environmental Targets

1. Reduce complaints and human error with "clean" quality

  1. Reduction of external complaints
  2. Reduction of internal complaints
  3. Reduction of F costs
  4. Reduction of human error

2. Controlling CO2 emissions by working on SDGs (reducing wasteful raw materials and energy resources, improving work efficiency without waste and unevenness) in a "Kirei" environment

  1. Reduction of raw material usage (low money, small Ni, etc.)
  2. Reduction or maintenance of energy resource consumption (water, electricity, heavy oil, city gas)
  3. Reduction or maintenance of waste emissions
  4. Non-use of minerals, etc. in conflict zones
  5. Proposal of improvement in work efficiency by ingenuity
  6. Review of wasteful mechanisms (review of heavy management, efficiency of mechanisms, simplification, and efficiency in IT)

3.Materialize and embody "be kind to people and take good care of others"

  1. Creating a safe and secure work environment
    1. We will utilize the Safety and Health Committee and safety patrols to create an environment that never causes workers’ compensation, accidents (chemical accidents, pollution control), or fires.
    2. Thorough 5S3T (thorough cleaning, removal of crystals, contact polishing, cutting debris cleaning, measures against garbage and Garbage fluff, maintenance and maintenance of production facilities)
    3. Responsibility as a chemical company Thorough maintenance and maintenance in environmental equipment
  2. Strengthening the utilization of human resources
    1. Bottom-up of employee skills (skill-up education, multi-skilled workers)
    2. Appointment of female human resources

Initiatives for Management, Quality, and Environmental Targets

In order to achieve management, quality, and environmental targets (MS targets), the project team, each department of each office, and the staff department formulate an execution plan to fulfill a given role and carry out initiatives.

Response to conflict minerals

It is said that some of the minerals produced in the Democratic Republic of the Congo and the surrounding countries (DRC countries) are the source of funds for armed groups that perform inhumane acts. Among them, the “Financial Regulation Reform Act” (Dodd-Frank Act) was enacted in July 2010, and in Article 1502, columbite-tantalite (tantalum) and tin stone (tin) were used as conflict minerals (conflict minerals). ), gold and iron manganese heavies (tungsten) are listed, and US listed companies are required to disclose the usage status.

While international efforts are being made to address the above, the Yamato Denki Group will work to eliminate the use of conflict minerals in order to fulfill its social responsibility as a company in the supply chain.

Policy

We do not use conflict minerals that lead to inhumane activities.
If a material procurement investigation reveals that it is a conflict mineral, we will immediately stop trading.
We do not use conflict minerals that lead to inhumane activities. If it is found to be a material that is not limited to conflict minerals and that leads to inhumane activities, we will stop using it immediately.


Contact


    Machining

    Machinig and production equipments

    Machining

    Small lots for quick delivery of product types and number of machines owned by the many Metal (aluminum, iron, SUS system in general, titanium), and a variety of materials for processing resins 5Axis machines , corresponding to the goods polyhedral structure.

    Suwa local strengths , cooperation with neighboring manufacturer, supports a variety of processing (laser, sheet metal, printing, heat treatment, polishing, painting, etc.).

    Surface manufacturers strengths , corresponding to various surface treatment design and manufacture of parts compatible.

    Example: 5axis machining

    Demonstration ~T2 scalp~
    Machine:Mazak Variaxis630 5XⅡ
    CAD/CAM: MasterCAM XⅡ
    Machining time 18H

    Production equipment

    Shortening produced by processing in-house sourcing (for short time) can be low cost and when changing the design , in the short term additional machining of fine-tuning during assembly, parts procurement available.

    Production Drawing from your concept, improving existing equipment and parts production and assembly drawings to accommodate your various needs flexibly.

    Carrier machine

    Separator for the mixture of Steel ball and chip devices


    Plating for Microelectronics

    Plating of electronics substrate and devices for microelectronics

    Electroless Au plating for fineline circuit on PC board

    (L/S = 30/30µm)

    Electroless Ni/Pd/Au plating for micro-circuit

    Excellent soldering, wirebondability. 3layers plating:Ni/Pd/Au is improved surface mounting reliability.

    Au Wire pull test

    Ball share test

    Au Plating for LTCC substrate

    Electroless plating process for LTCC substrate silver electrode

    Wire pull strength on thicktype electroless Au plating film

    Electrode: Electroless plating on Ag/Pt
    Plating thickness: Ni3μm Au0.4μm N=50
    Au wire: 30μmφ Bonder: Kaijo118CH (Full auto type)

    Gold plating for electroless wire bonding for semiconductor wafers

    In recent years, while UBM formation (Under Bump Metal) by electroless plating on semiconductor wafer mounting pad electrodes has attracted attention, we have cultivated for many years, utilizing the gold plating technology for printed circuit boards used in SMD, etc., it is possible to process electroless gold plating for stable wire bonding.
    Even wafers with a mixture of SR and polyimides can be selectively bonded gold plating on the pad.

    Plating ProcessPlating ThicknessWafer SizeWafer ThicknessPadPad Size
    ENIG
    (Eletroless Ni/F-Au)
    Ni:0.5~10um
    Pd:0.02~0.8um
    Au:0.02~0.8um
    Small pieces
    ~8inch
    *10 inches can be prototyped
    300um~2mm
    ※300um or less Wafer reinforced by tape as needed
    Alφ10um~
    Plating support possible
    ENIGAG
    (Electroless Ni/Thick-Au)
    Al-Si
    ENEPIG
    (Electroless Ni/Pd/F-Au)
    Al-Si-Cu
    ENEPIGAG
    (Electroless Ni/Pd/Thick Au)
    Al-Cu
    Cu

    Micro spot plating for micro connector

    Spot plating is plated with technology only where necessary.
    Can significantly reduce the amount of use Au.

    Material: Cu alloy
    Material Thicness: 0.08mm~
    Material width: ~20mm
    Plathing thicness: Ni 1μm~ Au0.1~0.5μm
    Solder Barrier area: 0.3mm~
    Method of forming a Solder Barrier : Lazer or special masking

    Reel to reel plating for presses devices for automotive applications

    TransportBy vertical transport, both single-tie bar and center carrier are possible.
    Product shapeMaterials, primary pressed both possible
    The material amplitudetandard Max100mmW *Consultation for more cases
    Material thicknessStandard Max0.8mmt *Consultation for no more
    OthersConsultation on mixed specifications of stripe and spot plating, stripe plating (±0.1 mm), etc.

    Four color plating

    Reflow tin plating with each different thickness

    Spot plating

    Sn reflow plating for automotive press-fit terminals

    The temperature profile of the reflow is checked by the initial condition setting, and the pure tin thickness and the diffusion layer thickness are controlled. If necessary, we perform cross-sectional observation by CP and IM to ensure the plating layer structure.

    Pb free plating

    Reflow tin plating

    Tin plating is used as an alternative to leadcontaining solder plating. It is necessary to take a measure for whisker. Internal stress of crystal particles which causes whiker can be eased by reflowing process. We produce reflow tin plating for connector in volume.

    Surface of reflow tin

    Zero-cross time (second)

     After platingPCT: 5hrsPCT: 16hrs
     Before reflowAfter reflowBefore reflowAfter reflowBefore reflowAfter reflow
    10.330.800.470.700.581.08
    20.430.700.420.800.511.36
    30.320.690.400.930.481.50
    40.320.710.500.950.301.04
    50.350.440.631.160.431.48
    AVE.0.350.670.480.910.461.29
    MAX.0.431.800.631.160.581.50
    Min.0.320.440.400.700.301.04
    STD.0.050.130.090.170.100.22

    Measurement: SWET-2000 / Sn-3Ag-0.5Cu Solder / Rosin flux
    PCT: 121℃-100℃RH

    Reflow tin whiskers

    Cu/Sn 1μm

    46 days later

    4 months later

    Barrel Plating

    ProductsAChip resistor, Chip capacitor, Chip inductor, Chip filter, SMD products by chip type
    BSmall stamping parts
    SizeAmin 1.0mm × 0.5mm ~
    BPin: min ø0.5mm × 2mm ~
    Plate: min 2.0mm × 1.5mm ~
    Plating ThicknessAElectrolytic Ni, Sn or Au
    BElectroless Ni, Electro Ni / Electro Au, Electro Ni / Electro Sn, Electro Ni / Electro Ag, Electro Cu

    A) Possible to plate various chip size devices with flexible treatment.
    B) Possible to plating small parts with various kind of plating.

    Plating on Metal foil

    Continuous Ni and Au plating are possible for Cu, stainless steel foil material with the thinnest 10μm thick. (Maximum width 160mm)
    It can be used as a reinforcing substrate for battery materials and flexible substrates.
    It is possible to form wax materials with gold tin, silver tin, and silver copper by plating method to 30μm thick kovar material.
    It is used as a sealing material such as ceramic packages.

     Material ThicknessPlatingPlating Thickness
    Kovar10μmAu80/Sn204~20μm
    Ag/Sn5~200μm
    Ag/Cu4μm~
    SUS・CuNi・Au1μm~
    Film with Cu20μm~Ni/Au1μm/0.1μm~

    Gold Tin Alloys by plating forming for Brazing assembly

    Can form the plating material is used in brazing electronic packaging devices.
    80Au/20Sn alloys by plating forming.

    Comparison of plating with rolling foil

      plating traditinal
    Oxdation
    Base material selection
    Out gas
    wettability
    Thicness control
    cost
    Ratio control

    New technology of plating for microelectronics

    Etching free plating without using roughned process

    Direct plating of organic film material

    Traditionally, when film formation to maintain smooth as glass and plastic, been using dry process is expensive.
    Maintaining surface smoothness of the material, can form a solid film by this new plating process.
    Maintain the smoothness of nanoscale.

    Without using a dry process, polyimide,glass,PET, PEN ,PPA, LCP, Polycarbonate plating can be formed into high performance and lowcost.
    Can also ITO electrode plating thicktype electroless Au.

    Direct plating on glass

    Usually, direct plating to glass strongly roughs the glass surface with hydrofluoric acid, etc., but in our development process, it is possible to form a plating film with mirror gloss by adopting a unique pretreatment that hardly devastates the material and a unique electroless plating with high uniformity.

    Electroless Cu plating

    Appearance surface roughness after plating
    Our pretreatment, which hardly devastates the material, allows the surface roughness of the nano-order to form a high-adhesion plating film.

    Zinc-free plating on aluminum

    Usually, aluminum materials are highly solubility in acids and alkalis, and it is common to chemically perform zinc substitution (zinc treatment) and perform plating processing.
    This technology is capable of plating directly into aluminum materials without zinc replacement treatment.
    As a result, the process is shortened, and the partial plating method can be easily performed.

    Process

    Preprocessing

    Material etching

    Au Strike Plating

    Bondable Au plating

    Example of direct gold plating for aluminum lead frame

    Material: A1020P.
    Au plating thickness: 1μm (stripe plating)

    Plating to non-woven fabric

    It is a technology to uniformly coat various plating coatings to fibers such as non-woven fabric.

    Roughed Ni plating

    Nickel plating with an increased surface area by roughing the plating film can be produced for applications such as improving adhesion to resins. The entire surface is uneven and the Rz is over 2.0 μm.

    FE-SEM secondary electron image (40° tilt)

    Example of coarsened nickel plating
    Material: Copper plate
    Ni plating thickness: 5.0μm~

    Unevenness measurement (laser microscope)

    Roughness measurement results
    Ra 0.31um
    Rz 2.04um

    Direct plating for titanium and SUS

    Gold plating and nickel plating are possible directly on titanium, which is represented by difficult-to-plating materials. There is no defect between the material and the plating, and the adhesion is good. In addition, copper plating with good direct adhesion on SUS also possible.

    FIB SIM image

    Example of direct gold plating for titanium
    Material: Titanium
      Au plating thickness: 0.2μm~

    FIB SIM image

    Example of direct copper plating of stainless steel
    Material: SUS304
    Cu plating thickness: 3.0μm~

    Electroless plating on ITO electrade

    Roughness if surface on ITO and glass substrate after etching

    ITO: Before etching

    Ra: 0.65nm Rz: 3.62nm

    ITO: After etching

    Ra: 2.78nm Rz: 14.37nm

    Glass: Before etching

    Ra: 0.35nm Rz: 1.84nm

    Glass: After etching

    Ra: 0.42nm Rz: 2.25nm

    By etching ITO selectively, the surface of glass has not changed while the ITO surface gets four times rough.


    Company Overview

    Introduction of Yamato

    Company Profile

    President & CEO F.Hara
    Capital 90million JPY
    Established 27/Apl/1944
    Employee 410
    Product Items ● Plating for micro-electronics devices, substrates and various materials.
    ● Machining works for tools and metal parts
    ● Machinery design and manufacture

    History

    Apr/1944 Established in
    5312 Shimosuwa,Nagano
    Jun/1970 Constructed Shimosuwa
    Oct/1970 Constructed Matsumoto
    Mar/1977 Constructed SUWA
    Aug/1983 Constructed Head office building
    Aug/1989 Established YamatoTEC
    Dec/1996 Registrated ISO9002
    Mar/2000 Registrated ISO14001
    Dec/2002 Registrated ISO9001#2000
    Mar/2005 Constructed R&D building
    Mar/2006 Registrated ISO14001#2004
    Sep/2008 Established Kohki Div.(Machining and equipment Div.)
    Dec/2008 Registrated ISO/TS16949:2000 in Matsumoto
    Oct/2012 Established Shinsei (Thailand) Co,.LTD
    Nov/2017 Mingrated to IATF16949:2016
    Dec/2017 Migrated to ISO2015
    ISO9001 :2015/JIS Q 9001:2015
    ISO14001 :2015/JIS Q 14001:2015
    Jan/2019 Made Shinsei (Thailand) Co.,LTD a wholly owned subsidiary and changed the company name to Yamato Denki (Thailand) Co., LTD.
    Jan/2021 Registrated IATF16949: 2016 certification in Suwa-factory

    Introduction of Yamato Denki (Thailand)

    Company Profile

    Location 40/17-19 Moo 5 , Rojana Industrial Park , T.U-Thai, A.U-Thai, Ayuttaya Province 13210
    Managing Director Masayuki Nakayama
    Establishment Construction 28/JUN/2005 Start business on 6 /Dec /2005
    Capital 50,000,000 THB (150mil.JPY)(Yamato IND 100%)
    Business Surface treatment For Microelectronics (HDD & CPU & automobile, Camera etc… )
    (Electroless Ni Plating / Electro Ni Plating / Electro Au Plating / Chemical Polishing / Ultra clean wash / etc)
    Employee 320 persons (Japanese staff 2 persons)as of July 2018
    All area Factory #1 = 5,529㎡ Floor area: 2,250㎡
    Factory #2 = 5,550㎡ Floor area: 1,875㎡
    Factory #3 = 6,075㎡ Floor area: 2,275㎡
    (Including Factory, Waste water treatment area)
    Other ISO9001:2008 ISO140001:2004 ISO/TS16949:2009 Certifired
    * TS16949 will be transferred to IATF16949 on November 2018.